WI-SKY-8132S-11

Ultra-short Depth 1U Edge Server based on 3rd Gen Intel® Xeon® Scalable Processor
  • 1U 11″ depth rackmount server for 5G Open RAN and edge computing
  • Single 3rd Gen Intel® Xeon® Scalable Processor supporting Platinum, Gold and Silver SKUs
  • 8x DIMM sockets for DDR4 3200MHz RDIMM
  • 2x PCIe Gen4 x16 FH/HL and 1x PCIe Gen4 x16 LP slots
  • 2x M.2 2280 SATA3/NVMe SSD
  • Customizable Telecom Alarm Module
  • IPMI 2.0 and Redfish compliant system management with reliability and security enhancements
  • Up to -40 ~ 65 °C operating temperature range
  • IP65 pole-mount or street side cabinet option/

認證:

Introduction

The WI-SKY-8132S-11 is a highly efficient, carrier-grade edge server designed to balance best-in-class Intel Xeon Scalable processing with maximum I/O and offload density in an 11″ ultra-short depth chassis. The system is a power optimized, robust platform that provides superior reliability in critical applications including, but not limited to 5G Open RAN and multi-access edge computing (MEC). The power and cooling options along with the streamlined mechanical design make it ideal for demanding telco edge deployments requiring high performance acceleration such as the Intel ACC100.

Architected around 3rd Gen Intel Xeon Scalable processors, the single-socket WI-SKY-8132S-11 combines cutting-edge performance with the ruggedness, reliability, and long system lifecycles required by the industry. The WI-SKY-8132S has been optimized for the 5G intelligent edge to integrate the required vRAN acceleration, I/O and time synchronization technology while optimizing performance per watt. This becomes essential to support compute-intensive 5G NR outdoor macrocell vDU use cases and advanced massive MIMO antenna systems.

The WI-SKY-8132S-11 supports extreme wide range operating temperature and environmental shock, vibration and dust conditions. Redundant DC power supplies, the ability to withstand single fan failures, redundant BIOS and firmware images with failsafe remote updates and hot swappable FRUs make the WI-SKY-8132S-11 the platform of choice for applications requiring virtually zero downtime. The WI-SKY-8132S-11 is designed for NEBS Level 3 carrier grade environments where limited space is available including front accessible network and power interfaces and IP65 pole mount, roadside unit or streetside cabinet configurations.

Specification
Processor System
Chipset
Intel® PCH C62xA series
CPU
Single socket 3rd Generation Intel® Xeon® Scalable Processor up to 36 cores, 225W TDP
Memory
Technology
Up to 8x 3200MHz DDR4 RDIMM/LRDIMM with ECC
Max Capacity

Max capacity per channel: 64GB
Max total capacity per system: 512GB

Socket
8 x 288-pin DDR4 DIMM
PCIe
Expansion slot

Front 2x PCIe 4.0×16 (FH/HL)
Front 1x PCIe 4.0×16 (LP)

Ethernet
Management Interface
NC-SI (BMC to I210-IS)
10/25GbE Ethernet
Via Add-on PCIe card
Controller
GbE LAN: Intel i210-IS support
Connector
2 x SFP ports
I/O and LEDs
Front I/O and LEDs
PWR, fan status, and alarm LEDs, 1 x console port, 2 x GE fiber ports (1 x management port), 2 x USB3.0 ports, and Telco alarm interface
Rear I/O
None
Storage

2 x SATA3/PCIe M.2 2280 module
1x 2.5″ SATA3/NVMe U.2 SSD (depends on SKU)

Power
Input

1+1 redundant DC input feeds
(A and B @-38V DC ~ -72V DC)

800W D/D power brick

Optional field replaceable 1+1 DC power supply units (@-38V DC ~ -72V DC)

*規格如有變更,恕不另行通知。
Cooling
Chassis Fan
9 x High Speed Fans
Thermal Control
Two separate thermal zones, one for payload and the other for power input, controlled by BMC solution
Redundancy
Resilient to single fan failure (depends on CPU model and configuration)
Air Filter
ODM customizable
System Management
IPMI2.0 and Redfish API
  • Aspeed AST2500 BMC with System Management Solution
  • Advanced Lights Out Management compliant to IPMI2.0 with security and availability enhancements
  • Redfish API support
  • iKVM Support Web GUI style Node Manager
  • Configurable shared or dedicated NIC support
Environment
Temperature

Operating: -40~65°C (-40~149°F)
Depends on CPU model and configuration
Non-Operating: -40 ~ 70°C (-40 ~ 158°F)

Humidity
(non-condensing)

Operating: 50% @25°C to 95%@40°C
Non-Operating: 95% @60°C

Physical

Dimensions
(W x D x H)

445 x 291 x 43.8mm (17.5″ x 11.5″ x 1.72″)
Or, 440 x 331.5 x 43.8mm (17.5″ x 13.1″ x 1.72″) with advanced heatsink to meet 65°C operating temperature for 185W TDP CPU (designed to fit 300mm depth racks)

Weight (N.W)
Approximately 8kg