WI-SKY-8232DV2

Compact 2U Edge Server based on Dual 3rd Gen Intel® Xeon® Scalable Processors
  • 2U 20.7″ depth rackmount server for 5G open RAN and edge computing
  • Dual 3rd Gen Intel® Xeon® Scalable Processor supporting Platinum, Gold and Silver SKUs
  • 32 x DIMM sockets DDR4 3200 MHz (ECC/RDIMM/LRDIMM)
  • 4 x FH/FL PCIe 4.0 x16 + 2 x LP PCIe 4.0 x8 slots, or 2 x FH/FL PCIe 4.0 x16 slots + 2 x FH/FL PCIe 4.0 x8 slots + 2 x FH/HL PCIe 4.0 x8 slots + 2 x LP PCIe 4.0 x8 slots
  • 4 x 2.5″ SATA HDD/SSD drives or 2 x 2.5″ SATA SSD + 2x NVMe U.2 SSD
  • 2 x M.2 2280 SATA SSD
  • IPMI 2.0 and Redfish compliant system management with reliability and security enhancements

認證:

Introduction

The WI-SKY-8232DV2 is highly efficient, high performance, carrier-grade edge server designed to balance the best in x86 server-class processing with maximum I/O and offload density in a 20″ depth chassis. The system is a cost effective, robust platform optimized for superior reliability in business and mission critical applications including but not limited to 5G vRAN and edge computing.

The WI-SKY-8232DV2 is a dual socket high performance, highly reliable platform based on 3rd Gen Intel Xeon Scalable processors. It supports high density PCIe Gen4 card payload to integrate multiple 10/25/40/100GbE network interfaces and acceleration cards enabling high performance and low latency flexible configurations.

To deliver sustained processing performance in harsh edge environments, the WI-SKY-8232DV2 supports extended operating temperature range, dust and humidity. Redundant power supplies, the ability to withstand single fan failures, redundant firmware images with failsafe updates and hot swappable FRUs minimize costly downtime, service interruptions and onsite interventions when deploying high computing power in remote network locations. The WI-SKY-8232DV2 is designed for NEBS Level 3 carrier grade environments and where limited rack space is available.

All WI-SKY-8000 servers manufactured by leverage a fully integrated value-chain from in-house design and self-owned factory to global logistics and local support ensuring a “no surprise” policy and keeping servers competitive.

Specification
Processor System
Chipset
Intel® PCH C62xA series
CPU
Dual socket 3rd Generation Intel® Xeon® Scalable Processor up to 185W TDP
Memory
Technology
Up to 32x 3200MHz DDR4 ECC RDIMM/LRDIMM
Max Capacity

Max capacity per channel: 64GB
Max total capacity per system: 2048GB

Socket
288-pin DIMM
PCIe
Expansion slot
  • 4x FH/FL PCIe 4.0 X16 + 2x LP PCIe 4.0 x8
  • 2x FH/FL PCIe 4.0 x16 slots + 2x FH/FL PCIe 4.0 x8 slots + 2x FH/HL PCIe 4.0 x8 slots+2x LP PCIe 4.0 x8
Ethernet
Management Interface
10/100/1000 Mbps
Controller
GbE LAN: Intel i210-AT support
Connector
3 x RJ45
I/O
Front I/O
1x USB3.0 (Upper port), 1x USB2.0 (lower port), VGA port ,PWR, Status, ALARM LEDs
Rear I/O
2 x GbE LAN RJ45, 1 x Management port,1 x VGA, 2 x USB3.0, 1 x Console port 1 x OCP3.0 (PCIe 4.0 x16) module slot
Storage
Internal
2 x 2.5″ SATA SSD
Rear (Internal)
2 x 2.5″ SATA/PCIe SSD
On-board
2 x M.2 2280 SATA
*規格如有變更,恕不另行通知。
Power
Input

1200W AC CRPS module
100 ~ 240V AC, 12~7A, 50~60HZ

Cooling
Chassis Fan
6 x 6056 high speed fans (N+1 redundant)
Thermal Control
Two separate thermal zones for motherboard and Full Length (FL) PCIe cards
Reliability
Resilient to single fan failure
Air Filter
Yes (Optional)
System Management
IPMI
  • Aspeed AST2500 BMC with System Management Solution
  • Advanced Lights Out Management compliant to IPMI2.0 with security and availability enhancements
  • Redfish API support iKVM and Support Web GUI style Node Manager
  • Configurable shared or dedicated NIC support
Environment
Temperature

Operating: -5 ~ 55 °C (23 ~ 131 °F)
Non-Operating: -40 ~ 70 °C (-40 ~ 158 °F)

Humidity
(non-condensing)

Operating: 50% @25°C to 95%@40 °C
Non-Operating: 95% @60 °C

Physical

Dimensions
(W x D x H)

438 x 526 x 87 mm
(17.24″ x 20.7″ x 3.48″)

Weight (N.W)
~18kg