WI-X11DPL-I

12″ x 10″
  • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
    Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 140W TDP, 2 UPI up to 10.4 GT/s
  • Intel® C621
  • Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
  • 2 PCIe 3.0 x16,
    3 PCIe 3.0 x8,
    1 PCIe 3.0 x4 (in x8 slot)
    M.2 Interface: 1 SATA/PCIe 3.0 x4
    M.2 Form Factor: 2260, 2280
    M.2 Key: M-Key
  • Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • Dual LAN with 1GbE with Intel® X722 + Marvell 88E1512
  • 1 VGA port
Specification
System
CPU

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors

Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 140W TDP, Dual UPI up to 10.4 GT/s

Chipset
Intel® C621
System Memory

8 DIMM slots
Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz

BIOS
AMI UEFI
Graphic
1 ASPEED AST2500 BMC port(s)
Expansion Slot

2 PCIe 3.0 x16,

3 PCIe 3.0 x8,

1 PCIe 3.0 x4 (in x8 slot)

M.2 Interface: 1 SATA/PCIe 3.0 x4

Form Factor: 2280, 2260

Key: M-Key

Mini Type Slot
N/A
Power type
ATX
Dimension
12.076″ x 10.15″ (30.67cm x 25.78cm)
I/O Interface
Display
1 VGA port(s)
Storage
Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Ethernet
Dual LAN with 1GbE with Intel® X722 + Marvell 88E1512
Audio
N/A
USB

4 USB 2.0 port(s) (2 rear; 2 via header)

3 USB 3.2 Gen1 port(s) (2 via header; 1 type A)

Internal USB Port
1 USB 3.0
Serial
1 COM Port(s) (1 header)
PS/2 Port
N/A
TPM
1 TPM Header
SMBus
Digital I/O
*規格如有變更,恕不另行通知。